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Semiconductor Packaging Technology Basics

Semiconductor Packaging Technology Basics

Semiconductor Packaging Technology Basics

Course Information

30 Days
3 Lessons

Course fee

₩200,000

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Syllabus(Total 3 Lesson(s))

1. 패키징 기술의 현재 29 Min(s)

2. 패키징 공정 기초 37 Min(s)

3. 첨단 반도체 패키징 구조 34 Min(s)